Morgan Lewis Advises Reed Semiconductor on $100M Round

SILICON VALLEY, June 26, 2026: Morgan Lewis advised Reed Semiconductor on the completion of an upsized, oversubscribed $100 million funding round. The new capital will accelerate product development, broaden market reach, and enhance operational scale.

Founded in 2019, Reed Semiconductor develops power management semiconductor technologies that improve power delivery efficiency while reducing system size, power consumption, and overall solution cost. The company’s proprietary power devices, drive architectures, and advanced packaging technologies enable high-performance power solutions for a wide range of applications.

Morgan Lewis partner John Park and associates Andrew Yao and Ben Enriquez advised Reed Semiconductor. 

For more, read Reed Semiconductor’s announcement.